


Tiffany Schmierer In-Person Workshop- September 27, 2025
Date: Saturday, September 27, 2025
Time: 1 to 4 p.m.
Location: In Person, John Natsoulas Gallery
Description:
The Clay Canvas: Exploring Surface Techniques
This workshop will cover various surface techniques you can layer onto your ceramic pieces to create detailed surface designs. We will explore stamps, press molds, stencils, resist materials, and different underglaze applications. Participants will work on tiles at different stages, from wet to bisque.
The surface skills learned during the workshop can be applied in your studio on sculpture or pottery, for a range of temperatures. Bring your basic clay tools and brushes. Come ready to play and explore.
Date: Saturday, September 27, 2025
Time: 1 to 4 p.m.
Location: In Person, John Natsoulas Gallery
Description:
The Clay Canvas: Exploring Surface Techniques
This workshop will cover various surface techniques you can layer onto your ceramic pieces to create detailed surface designs. We will explore stamps, press molds, stencils, resist materials, and different underglaze applications. Participants will work on tiles at different stages, from wet to bisque.
The surface skills learned during the workshop can be applied in your studio on sculpture or pottery, for a range of temperatures. Bring your basic clay tools and brushes. Come ready to play and explore.
Date: Saturday, September 27, 2025
Time: 1 to 4 p.m.
Location: In Person, John Natsoulas Gallery
Description:
The Clay Canvas: Exploring Surface Techniques
This workshop will cover various surface techniques you can layer onto your ceramic pieces to create detailed surface designs. We will explore stamps, press molds, stencils, resist materials, and different underglaze applications. Participants will work on tiles at different stages, from wet to bisque.
The surface skills learned during the workshop can be applied in your studio on sculpture or pottery, for a range of temperatures. Bring your basic clay tools and brushes. Come ready to play and explore.